DSP45-16AR phase leg standard rectifier 1 2 3 part number DSP45-16AR backside: isolated fav f v v 1.23 rrm 45 1600 = v = v i = a 2x features / advantages: applications: package: planar passivated chips very low leakage current very low forward voltage drop improved thermal behaviour diode for main rectification for single and three phase bridge configurations isoplus247 industry standard outline rohs compliant epoxy meets ul 94v-0 soldering pins for pcb mounting backside: dcb ceramic reduced weight advanced power cycling isolation voltage: v~ 3600 the data contained in this product data sheet is ex clusively intended for technically trained staff. t he user will have to evaluate the suitability of th e product for the intended application and the completeness of the product data with respect t o his application. the specifications of our compon ents may not be considered as an assurance of compo nent characteristics. the information in the valid application- and assembly notes must be considered. should you require produc t information in excess of the data given in this p roduct data sheet or which concerns the specific application of your product, please co ntact the sales office, which is responsible for yo u. due to technical requirements our product may conta in dangerous substances. for information on the typ es in question please contact the sales office, whi ch is responsible for you. should you intend to use the product in aviation, i n health or live endangering or life support applic ations, please notify. for any such application we urgently recommend - to perform joint risk and quality assessments; - the conclusion of quality agreements; - to establish joint measures of an ongoing product survey, and that we may make delivery dependent on the realization of any such measures. terms conditions of usage: ixys reserves the right to change limits, condition s and dimensions. 20130215c data according to iec 60747and per semiconductor un less otherwise specified ? 2013 ixys all rights reserved
DSP45-16AR v = v a2s a2s ka2s ka2s symbol definition ratings typ. max. i r v i a v f 1.26 r 0.9 k/w r min. 45 v rsm v 40 t = 25c vj t = c vj ma 1.5 v = v r t = 25c vj i = a f v t = c c 100 p tot 165 w t = 25c c r k/w 45 1600 max. non-repetitive reverse blocking voltage reverse current forward voltage drop total power dissipation conditions unit 1.57 t = 25c vj 150 v f0 v 0.81 t = c vj 175 r f 9.1 m ? v 1.23 t = c vj i = a f v 45 1.66 i = a f 90 i = a f 90 threshold voltage slope resistance for power loss calculation only a 150 v rrm v 1600 max. repetitive reverse blocking voltage t = 25c vj c j 18 junction capacitance v = v; 400 t = 25c f = 1 mhz r vj pf i fsm t = 10 ms; (50 hz), sine t = 45c vj max. forward surge current t = c vj 150 i2t t = 45c value for fusing t = c 150 v = 0 v r v = 0 v r v = 0 v v = 0 v t = 8,3 ms; (60 hz), sine t = 10 ms; (50 hz), sine t = 8,3 ms; (60 hz), sine t = 10 ms; (50 hz), sine t = 8,3 ms; (60 hz), sine t = 10 ms; (50 hz), sine t = 8,3 ms; (60 hz), sine vj r vj r t = c vj 175 480 520 840 805 aa a a 410 440 1.15 1.13 1600 fav 180 sine average forward current thermal resistance junction to case thjc thermal resistance case to heatsink thch rectifier 1700 0.25 ixys reserves the right to change limits, condition s and dimensions. 20130215c data according to iec 60747and per semiconductor un less otherwise specified ? 2013 ixys all rights reserved
DSP45-16AR ratings pr odu c t m a rk in g date code part no. logo ixys abcd assembly code zyyww assembly line isoplus? xxxxxxxxx dsp45-16az to-268aa (d3pak) (2hv) 1600 package t op c t vj c 175 virtual junction temperature -40 weight g 6 symbol definition typ. max. min. conditions operation temperature unit f c n 120 mounting force with clip 20 v v t = 1 second v t = 1 minute isolation voltage mm mm 2.7 4.1 d spp/app creepage distance on surface | striking distance th rough air d spb/apb terminal to backside i rms rms current 70 a per terminal 150 -40 terminal to terminal dsp45-12a dsp45-12az to-247ad (3) to-268aa (d3pak) (2hv) 1200 1200 dsp45-18a to-247ad (3) 1800 isoplus247 similar part package voltage class dsp45-16a to-247ad (3) 1600 delivery mode quantity code no. ordering number marking on product ordering 50/60 hz, rms; i 1 ma isol DSP45-16AR 496561 tube 30 DSP45-16AR standard 3600 isol t stg c 150 storage temperature -40 3000 threshold voltage v 0.81 m ? v 0 max r 0 max slope resistance * 6.5 equivalent circuits for simulation t = vj i v 0 r 0 rectifier 175 c * on die level ixys reserves the right to change limits, condition s and dimensions. 20130215c data according to iec 60747and per semiconductor un less otherwise specified ? 2013 ixys all rights reserved
DSP45-16AR die konvexe form des substrates ist typ. < 0.04 mm ber der kunststoffoberfl?che der bauteilunterseite the convex bow of substrate is typ. < 0.04 mm over plastic surface level of device bottom side die geh?useabmessungen entsprechen dem typ to-247 ad gem?? jedec au?er schraubloch und l max . this drawing will meet all dimensions requiarement of jedec outline to-247 ad except screw hole and except l max . min max min max a 4.83 5.21 0.190 0.205 a1 2.29 2.54 0.090 0.100 a2 1.91 2.16 0.075 0.085 b 1.14 1.40 0.045 0.055 b2 1.91 2.20 0.075 0.087 b4 2.92 3.24 0.115 0.128 c 0.61 0.83 0.024 0.033 d 20.80 21.34 0.819 0.840 d1 15.75 16.26 0.620 0.640 d2 1.65 2.15 0.065 0.085 d3 20.30 20.70 0.799 0.815 e 15.75 16.13 0.620 0.635 e1 13.21 13.72 0.520 0.540 e 5.45 bsc 0.215 bsc l 19.81 20.60 0.780 0.811 l1 3.81 4.38 0.150 0.172 q 5.59 6.20 0.220 0.244 r 4.25 5.50 0.167 0.217 w - 0.10 - 0.004 dim. millimeter inches e 1 2 3 r d l l1 q 3x b 2x b2 b4 w a a2 c a1 2x e e1 d1 d2 d3 1 2 3 outlines isoplus247 ixys reserves the right to change limits, condition s and dimensions. 20130215c data according to iec 60747and per semiconductor un less otherwise specified ? 2013 ixys all rights reserved
DSP45-16AR 0.001 0.01 0.1 1 200 240 280 320 360 4 0 0 2 3 4 5 6 7 8 9 01 1 0 200 400 600 800 1000 1 2 00 0.5 1.0 1.5 0 10 20 30 40 50 60 70 80 0 10 20 30 40 50 60 0 20 40 60 80 0 50 100 150 200 1 10 100 1000 10000 0.0 0.2 0.4 0.6 0.8 1.0 i 2 t [a 2 s] i fsm [a] i f [a] v f [v] t [s] p tot [w] i davm [a] t amb [c] t [ms] z th [k/w] 0 50 100 150 200 0 20 40 60 80 t c [c] 50 hz, 80% v rrm t vj = 45c t vj = 45c t vj = 150c t vj = 150c t [ms] i davm [a] v r = 0 v fig. 1 forward current versus voltage drop per diode fig. 2 surge overload current fig. 3 i 2 t versus time per diode fig. 4 power dissipation vs. direct output current & ambient temperature fig. 5 max. forward current vs. case temperature fig. 6 transient thermal impedance junction to case t vj = 150c 125c 25c dc = 1 0.5 0.4 0.33 0.17 0.08 r thja : 0.6 kw 0.8 kw 1 kw 2 kw 4 kw 8 kw dc = 1 0.5 0.4 0.33 0.17 0.08 i r i t i 1 0.0607 0.0004 2 0.123 0.00256 3 0.2305 0.045 4 0.323 0.0242 5 0.1628 0.18 rectifier ixys reserves the right to change limits, condition s and dimensions. 20130215c data according to iec 60747and per semiconductor un less otherwise specified ? 2013 ixys all rights reserved
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